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The ENERMAX ETS-T40-W CPU cooler employ a unique TCC (Thermal Conductive Coating) to create better velocity of thermal transference and prevent oxidation on the contact surface. It delivers world leading thermal resistance performance of 0.085°C/W thanks to the combination of three smart innovations: Stack Effect Flow, Vortex Generator Flow, and Vacuum Effect Flow. Its four 0.6mm high-performance heat pipes with HDT (Heatpipe Direct Touch) ensure rapid thermal conduction and eliminate CPU hotspots. The ETS-T40-W also comes with one 12cm Twister Bearing PWM fan with an operating range of 800RPM to 1800RPM. Plus, the ETS-T40-W feature a universal bracket that is compliant with most Intel and AMD sockets, including Intel’s 4th Generation processors.
Unique TCC design The ETS-T40-W features a unique TCC (Thermal Conductive Coating) to improve thermal transference and prevent oxidation of the contact surface.
Thermal Resistance Performance of 0.085°C/W The world leading thermal resistance performance of 0.085°C/W is achieved by three smart innovations: Stack Effect Flow to enhance heat transfer, Vortex Generator Flow to greatly increase air convection, and a unique air path creating high VEF (Vacuum Effect) to optimize the airflow.
Heat Pipe Direct Touch The ETS-T40-W features the side flow type with four 0.6mm high-performance heat pipes using HDT so the heat from CPU will be transferred directly to the heat pipes without additional resistance.
120mm PWM Cooling Fan The ETS-T40-W is available with dual fan option and its 12cm Twister Bearing PWM fan automatically adjusts the speed according to the requirements of the particular CPU platform.
Universal Compatibility The ETS-T40-W includes a universal bracket for Intel LGA775/1150/1155/1156/1366/2011 and AMD AM2/AM2+/AM3/AM3+/FM1/FM2. The bracket also supports Intel’s latest 4th Generation processors.
Anti-Vibration Rubbers and High Thermal Conductivity Grease Anti-vibration rubbers prevent fan vibration and absorb noise. High thermal conductivity grease ensures the best thermal conduction between CPU and the heat sink.
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