Junpus JP-D9000 Nano Diamond Thermal Grease /Overclocking Thermal Compound / LN2 Thermal paste (3g)

Specifications JunPus JP-D9000 Nano Diamond Thermal Grease (3G) Thermal Conductivity 9.6 w/m-K Thermal Impedance 0.08 cm²/W Specific Gravity 2.7 g/cm³ Recommended storage time (Before use) up to 3 years Recommended usage time (On the CPU) up to 4 years Peak operating temperature -50°C to +150°C Recommended operating temperature -40°C to +140°C Weight 3g Overview JP-Diamond-Series is a top-quality heat sink compound product developed most recently by Taiwan & Russian nano technology. Made with high purity thermal conducting materials, JP-Diamond-Series exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. JP-Diamond-Series has the following superior properties such as high chemical stability, being non-corrosive, Antioxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin.

It can withstand long-term storage, does not easily solidify, and can Bereadily implemented to the printing and coating process. Key Features Thermal Conductivity Low Thermal Resistance Non-Curing Non-Corrosive Easy Application with
Included Razor Blade Color: Gray