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JunPus International Co., Ltd. > 
Item#: 9SIA3TW18W4911

JunPus High-Performance Thermal Pad JP-P600 ,50x50x1.5mm,Thermal Conductivity 6.0 W/mK

  • JP-P600505015

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JunPus High-Performance Thermal Pad JP-P600 ,(50x50mm)
Thermal Conductivity 6 w/m-K
Thickness (mm) 1.5mm
Hardness 25 shore 00
Color Blue
Thermal Resistance 0.18
Volume resistivity 1.7x1013(Ocm)
UL94 V0
Temperature Stability(?) -40°C to +120°C
Size 50mm*50mm


JunPus improved thermal pads with 6W/mK are able to match even high-end thermal compounds!
These thermal pads are perfectly suited to equalize height differences and uneven spots on coolers and cooled elements.

The very flexible structure and low hardness allow great adaptivity to the cooling surface even at low contact pressures. The thermal pad equalizes the effect of irregularities from microscopic scale to visible scratches etc. The surface of the pad is slightly sticky and is equipped with a protective foil when shipped. This foil must be removed before installation. Now the slight adhesive properties of the pad come into play and prevent slipping of the pad on the cooler or cooled element. Of course these pads can also be cut to the desired size. The pads can be used on VRAM modules on graphics cards as well as on the VRM modules on a Mainboard or almost any other application where a high-performance thermal interface is desired. Even elements with large surfaces such as North- or Southbridge on a Mainboard are no problem for this thermal pad as it has great thermal conductivity.

As basic equipment and spare parts these thermal pads should be a part of any cooling enthusiast's equipment!

Key Features

Premium Quality
Above standard Thermal Conductivity
Easy to Use
Easily Cut / Altered for All Applications

Learn more about the JunPus International Co., Ltd. JP-P600505015


JunPus International Co., Ltd.
Warranty, Returns, And Additional Information

Customer Reviews of the JunPus International Co., Ltd. JP-P600505015

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  • Benn F.
  • 2/20/2015 1:32:36 PM
  • Tech Level: Somewhat High
  • Ownership: 1 week to 1 month
  • Verified Owner

5 out of 5 eggsFast and Easy

Pros: Reasonably sticky, stays in place well but can be positioned if not yet compressed.
Great for filling gaps with loose fitting heat sinks.
Compresses well and does not spread uncontrollably like liquids.
Thermal dissipation is exceeding factory thermal compound everywhere i have used it thus far.

Cons: none so far

Other Thoughts: the pad was a lot larger than i expected being unfamiliar with the metric system.

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