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Arctic Silver 5 High-Density Polysynthetic Silver Thermal Compound AS5-3.5G

Ships from United States.

Sold and Shipped by Newegg

Made With 99.9% Pure Silver
High-Density Polysynthetic Silver Thermal Compound
Controlled Triple-Phase Viscosity

Please note that this product is non-returnable and non-refundable.

Arctic Silver 5 High-Density Polysynthetic Silver Thermal Compound AS5-3.5G

Ships from United States.

Overview
Specifications
Warranty & Returns
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Q&A

Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Arctic Silver 5 thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. This 3.5-gram tube contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates.

Note: This is an OEM (Original Equipment Manufacturer) version, which includes the product, but nothing else. They are packaged generically and are best suited for system builders who don't require documentation or bundled accessories.

99.9% Pure Silver The Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
High Density The Arctic Silver 5 contains over 88% thermally conductive filler by weight. The thermally-enhanced ceramic particles including micronized silver, sub-micron zinc oxide, aluminum oxide and boron nitride particles improve the compound's performance and long-term stability.

Learn more about the Arctic Silver AS5-3.5G

Model

Brand: Arctic Silver

Model: AS5-3.5G

Details

Specifications: Average Particle Size:
< 0.49 micron < 0.000020 inch

Extended Temperature Limits:
Peak: -50 Celsius Degree to >180 Celsius Degree
Long-Term: -50 Celsius Degree to 130 Celsius Degree

Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.

Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.

Features

Features: Three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
Contains over 88% thermally conductive filler by weight. These thermally-enhanced ceramic particles improve the compound's performance and long-term stability.
Ensure the best physical contact between the heatsink and the CPU core.
Will not separate, run, migrate, or bleed.