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Like its larger 812 variation, TPC 612 utilizes vertical vapor chambers in conjunction with heatpipes to enhance cooling performance. With the two technologies working in tandem, TPC 612 is ready to handle the massive heat released by your processor during intensive tasks such as overclocking and benchmarking. A specially designed aluminum fin structure and fan mounting bracket makes TPC 612 an excellent thermal solution that is both effective and easy to work with.
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VERTICAL VAPOR CHAMBER TECHNOLOGY |
RAPID HEAT TRANSFER AND DISSIPATION |
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TPC 612 combines vertical vapor chambers with the time-tested effectiveness of traditional heatpipes. The synergy between the two cooling methods provide accelerated thermal transfer and heat dissipation. |
Vapor chambers house a special coolant that changes from a liquid to gas when heated. The vaporized coolant then condenses on cold surfaces such as the aluminum fins where thermal transfer and dissipation quickly occur. |
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NICKEL PLATED, POLISHED COPPER BASE |
SPECIAL ALUMINUM FIN STRUCTURE |
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The natural ability of copper to effectively transfer heat is fully utilized in TPC 612 as it features a 100%, pure polished copper base to maximize thermal transfer between the CPU and cooler. |
The TPC 612 fin structure is laid out in a special way to ensure concentrated intake and delivery of cool air directly to the heatsink area. |
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TPC 612 CPU Cooler |
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Accessory Kit |
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User Manual |
This Model |
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TPC 612 |
TPC 812 |
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Vertical Vapor Chambers |
2 |
2 |
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Heatpipes |
4 |
6 |
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Dimensions (L x W x H) |
5.7 x 3.8 x 6.4 inches |
5.4 x 4.1 x 6.4 inches |
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Compatible CPU Sockets |
Intel: LGA 2011, 1366, 1156, 1155, 1150, 775 |
Intel: LGA 2011, 1366, 1156, 1155, 1150, 775 |
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100% Polished Copper Base |
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Aluminum Alloy Fin Structure |
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Clip-On Fan Mounting Bracket |
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Vapor Chamber and Quality Heat Pipes The vertical vapor chamber and four 6mm heat pipes allow a quicker and more efficient heat spread than solid metal heatsinks.
Copper Base The nickel-plated, 100% copper base – combined with improved soldering technologies – allows the best thermal transfer.
Dense Fins and Silent Fans The silent fan blows cool air over the surface of the fins. The dense fins provide a large dissipation area, with a special fin design, that receives the condensed cold air flow.
Slim Profile Compatible with overclocking memory modules equipped with tall heat spreaders.
Broad Compatibility Supports both Intel and AMD platforms with the included brackets, including Intel LGA 2011, 1366, 1156, 1155, 1150, and 775 platforms, and AMD FM1, AM3+, AM3, AM2+, and AM2 platforms.

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