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Using Enzotech’s unique material forming technology, the SLF1-ULTRA is as powerful as it sounds. By maximizing the surface area, the SLF1-ULTRA has more than twice the amount of pin fins compared to the SLF-1 and produces more than 15% more performance as well. The ultimate source for thermal conductivity.
Broad compatibility With multiple push pin locations, the Enzotech SLF1-ULTRA can be mounted on various board assembly. (Hole to hole distance 53mm and 59mm).
Superior Heat Conductivity Formed of pure copper provides efficient thermal conductivity.
Excellent surface flatness Excellent surface flatness minimizes the interface between the heat source and heat sink for best efficiency within limited space.
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