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Features: Unique 2-Step Process:
ArctiClean 1 Thermal Material Remover quickly emulsifies and dissolves the existing thermal grease or pad from the CPU and/or heatsink so that it can easily be removed with a clean cloth or paper towel. A few drops of ArctiClean 2 Thermal Surface Purifier and some gentle wiping then removes the remaining residue and inhibits flash corrosion on copper or aluminum.
ArctiClean 1 Thermal Material Remover:
ArctiClean 1 uses a proprietary combination of non-toxic biodegradable solvents to emulsify thermal greases or thermal pads. The citrus and soy based solvents in ArctiClean 1 match or exceed many hazardsous and volatile solvents such as fluorinated and chlorinated organic solvents, acetone, MEK (methyl ethyl ketone), mineral spi...
Features: Unique 2-Step Process:
ArctiClean 1 Thermal Material Remover quickly emulsifies and dissolves the existing thermal grease or pad from the CPU and/or heatsink so that it can easily be removed with a clean cloth or paper towel. A few drops of ArctiClean 2 Thermal Surface Purifier and some gentle wiping then removes the remaining residue and inhibits flash corrosion on copper or aluminum.
ArctiClean 1 Thermal Material Remover:
ArctiClean 1 uses a proprietary combination of non-toxic biodegradable solvents to emulsify thermal greases or thermal pads. The citrus and soy based solvents in ArctiClean 1 match or exceed many hazardsous and volatile solvents such as fluorinated and chlorinated organic solvents, acetone, MEK (methyl ethyl ketone), mineral spi...
Specifications: Average Particle Size:
<0.36 micron <0.000014 inch (70 particles lined up in a row equal 1/1000th of an inch.)
Temperature Limits:
Peak: -150 Degrees C to >185 Degrees C
Long-Term: -150 Degrees C to 130 Degrees C
Coverage Area:
2.7-gram syringe. (Approximately 1cc)
At a layer 0.003" thick, one syringe will cover about 22 square inches.
25-gram syringe. (Approximately 9.2cc)
At a layer 0.003" thick, one syringe will cover about 200 square inches.
Features: Tri-Linear Ceramic Content:
Like the original Ceramique, Ceramique 2 uses only ceramic fillers so it is neither electrically conductive nor capacitive. The tri-linear composite of aluminum oxide, zinc oxide and boron nitride allows the thinnest possible bond line with modern processors, heatsinks and electronics. Critically-sized particles and new ultra-high shear mixing tech...
Specifications: Thermal Conductivity (W/mk): 8.5
Viscosity (poise): 870
Density (g/cm3): 2.5
Net Weight: 4g
The ARCTIC MX-4 is a premium-grade thermal paste with exceptional performance and ease of application. It is an electrically non-conductive paste that is applied between CPU/GPU and designated coolers to transfer the dissipated heat from the components to the heat sink. Since the ARCTIC MX-4 is a metal-free compound, it eliminates the risks of causing short circuit and in turn adding more protection to your computer.
The new formula in the ARCTIC MX-4 features optimal thermal conductivity and low thermal resistance. These characteristics effectively dissipate the emitted heat from the core components.
The consistency of the ARCTIC MX-4 is designed for simple application. Its texture is just thin enough to spread onto components using fingers without...
Specifications: Application: can be used on the rear side of the heatsink which has no thermal pad. It will improve the heat dispatch of your processor
Thermal Resistance: 0.06 °C/W
Thermal Conductivity: 7.5 W/m-K
Weight: 2.0 Gram
Dimensions: Injection tube 150 x 5 x 5mm. (w x d x h)
Color: White
Features: Low thermal resistance for superior heat transfer, 4.5W/mK
Small molecular size makes a better contact between the heatsink and heatsource.
Thin bond line for hi-efficiency conductivity
Low bleed under high pressure
Help the low-pressure clip design of cooler to achieve better cooling performance.
RoHS compliant
Not Electrically conductive
Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Features: Three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
Contains over 88% thermally conductive filler by weight.These thermally-enhanced ceramic particles impr...
Features: Characteristics:
Made with 99.8% pure micronized silver. 62% to 65% silver content by weight. Superior thermal performance.
Temperature Range:
- 40C to >150C (Bond strength is slightly weakened at temperatures below 0C due to crystallization.)
Negligible Electrical Conductivity:
Arctic Silver Thermal Adhesive was formulated to conduct heat, not electricity. NOTE: Even though Arctic Silver Thermal Adhesive is specifically engineered for high electrical resistance, it should be kept away from electrical traces, pins, and leads. The cured adhesive is slightly capacitive and could potentially cause problems if it bridged two close-proximity electrical paths.
Compliancy: RoHS Compliant.
Components:
A set of Arctic Silver Thermal Adhesive consists of two syringes containing a total of 7 grams of adhesive (3.5 grams each of parts
A and B) and a plas...
Features: Characteristics:
Arctic Alumina Adhesive uses a layered
composite of aluminum oxide and boron nitride.
Temperature range:
- 40C to >150C (Bond strength is slightly weakened at temperatures below 0C due to crystallization.)
Pure Electrical Insulator:
Arctic Alumina Adhesive is a pure electrical
insulator, neither electrically conductive nor capacitive.
Compliancy: RoHS Compliant.
Features: Better performance than TX-3 thermal grease.
Easy apply than TX-3 thermal grease
6.53W/mK Ultra-High thermal conductivity for superior heat transfer
Tends to form a thinner layer between CPU and heatsink than other greases even under low pressure
Helps the low-pressure clip design of cooler to achieve better cooling performance
RoHS compliant
Low bleed under high pressure
Not electrically conductive
High stability and reliability
Best solution for the heatpipe direct contact or heatpipe direct touch type CPU cooler.(Ex: Sunbeam Core Contact Freezer)
Specifications: Average Particle Size:
<0.39 micron <0.000015 inch (65 particles lined up in a row equal 1/1000th of an inch.
Temperature Limits:
Peak: -40 degree to >160 degree
Long-Term: -40 degree to 125 degree
Coverage Area:
1.75-gram syringe. (Approximately 1cc)
At a layer 0.003" thick, one syringe will cover about 24 square inches.
14-gram syringe. (Approximately 9cc)
At a layer 0.003" thick, one syringe will cover about 192 square inches.
Features: Absolute Stability:
Arctic Alumina will not separate, run, migrate, or bleed.
Electrical Insulator:
Arctic Alumina does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.
Performance:
2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or th...
Specifications: Average Particle Size:
<0.39 micron <0.000015 inch (65 particles lined up in a row equal 1/1000th of an inch.)
Temperature Limits:
Peak: -40 Degrees C to >160 Degrees C
Long-Term: -40 Degrees C to 125 Degrees C
Coverage Area:
1.75-gram syringe. (Approximately 1cc)
At a layer 0.003" thick, one syringe will cover about 24 square inches.
14-gram syringe. (Approximately 9cc)
At a layer 0.003" thick, one syringe will cover about 192 square inches.
Features: Premium Ceramic Content:
Arctic Alumina uses a layered composite of three unique shapes and sizes of ceramic particles to maximize particle-to-particle contact area and thermal transfer. This exclusive combination provides performance exceeding most metal based compounds.
Controlled Triple Phase Viscosity:
Arctic Alumina does not contain any silicone. The suspension fluid i...
Features: Excellent performance
NT-H1 consists of a hybrid compound of different micro-particles, which has been specifically optimized for use in PC environments. Thanks to its extremely low thermal resistance as well as excellent pliability and spreadability, NT-H1 achieves outstanding results.
Maximum ease of use & efficient dosage
As NT-H1 spreads very well under pressure, there's no need to smear it over the heat-spreader. This reduces both the consumption of paste and the time spent on the installation process: Put one drop of NT-H1 onto the centre of your CPU, install the cooler and that's it!
Top-performance right from the start
NT-H1 reaches its full performance extremely fast and doesn't require a longer "burn-in" time.
Excellent long-term stability
NT-H1 doesn't contain any solvents or other substances with low flash point and provides excellent lon...
Features: Ultimate Heat Conductivity
Non-Electrical Conductive
Non-Corrosive & Non-Curring
No Bleeding & User Friendly
GELID Applicator
Net Content of 3.5g
Specifications: Form: 1 Part
Color: White
Viscosity/Flowability: Nonflowing
Specific Gravity (cured): 2.37
Shelf Life: 24 months from DOM
Dielectric Constant: 4.4 at 100k Hz
Dissipation Factor 0.02 at 100k Hz
Dielectric Strength: 550 volts/mil; 21.7 kV/mm
Features: Suitable for CPU, chipsets on Mainboard, VGA card, etc.
Easy to use.
Zif Socket Templates ensure correct applying area with various CPU socket types.
Produces an even layer when using applicator.
Dielectric.
Wide range of application temperature.
Specifications: Average Particle Size: <0.36 microns <0.000015 inch (70 particles lined up in a row equal 1/1000th of an inch.)
Temperature limits: Peak: -150 Degrees C to >185 Degrees C Long-Term: -150 Degrees C to 130 Degrees C
Coverage Area: 25-gram syringes. (Approximately 9.2cc) At a layer 0.003" thick, one tube will cover about 200 square inches.
Important Reminder:
Due to the unique shapes and sizes of the particles in Ceramique 2, it will take a minimum of 25 hours and several thermal cycles to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode, the measured temperature will often drop slightly over this "break-in" period. This b...
Specifications: Diamond particles measuring 0.0000015 cm rated at 8.3 w/mK.
Extended -50°C to 250°C stable temperature range ideal for performance cooling.
Lighter, easier to spread stable composition won't crack or dry out.
Quantity: 4 g
Specific gravity: 2.8 g/cm3