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HyperX 4GB (2 x 2GB) 204-Pin DDR3 SO-DIMM DDR3 1066 (PC3 8500) Laptop Memory Model KHX8500S3ULK2/4GX

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DDR3 1066 (PC3 8500)
CAS Latency 5
1.5V
Dual Channel Kit

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Kingston HyperX series DDR3 SO-DIMM notebook memory modules are specifically engineered and designed for notebook PCs using Intel’s Cantiga mobile chipset. This high-performance mobile memory has passed Intel’s XMP certification process and comes pre-programmed with both JEDEC and XMP profiles for increased performance in the new DDR3 XMP-supported, Intel Centrino 2 Processor Technology systems.

The new Kingston HyperX SO-DIMM memory module is built with a new metal aluminum heatspreader that dissipates heat better than any other metal for consistent performance. By upgrading your notebooks with Kingston DDR3 XMP SO-DIMMs, you can reap the same extreme performance benefits, such as ultra-lower latencies and voltage, like enthusiasts and gamers have had for years with HyperX memory for desktop computers.

Designed for Intel Centrino 2 Mobile Platforms This Kingston HyperX KHX8500S3ULK2/4GX DDR3 SO-DIMM memory kit implements a high-performance specification optimized for Intel Centrino 2 mobile platforms utilizing Intel Core 2 Extreme mobile processors.
Intel XMP Certified The Kingston HyperX KHX8500S3ULK2/4GX has passed Intel’s XMP certification program and comes pre-programmed with both JEDEC and XMP profiles, enabling a robust, out-of-the-box overclocking solution for enthusiasts and pro-gamers.
Dual Channel DDR3 1066 DDR3 1066 at 8.5GB/s per channel in dual channel configuration eliminates performance bottlenecks with peak bandwidths of up to 17 GB/s.
High-performance Heat Spreaders The high-performance heat spreaders with HTX (HyperX Thermal Xchange) technology effectively dissipate heat from the memory module to ensure system stability.