Product Description Adopt ITX motherboard radiator compatibility specification design In the limited space, the heat pipe fins are welded twice to double the heat transfer efficiency Process
reflow soldering secondary finsRead more Heat dissipation
schematic of fin heat dissipation Nickel plating on copper mirror surface 0.5mm buckle fin process fine, stable, reduce wind loss(Note
the surface of pure copper version is pure copper anti-oxidation process)Read more