REINFORCED STRUCTURE
The heat spreader of T-FORCE DARK Z/Za series is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive.
ENHANCED HEAT DISSIPATION
With superconductivity – thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the DARK Z/Za memory can offer the finest and smoothest gaming experience and an extreme performance without any lag.
SELECTED IC CHIPS STABLE AND DURABLE
Every IC chip made for TEAMGROUP’s T-FORCE DARK Z/Za DDR4 gaming memory is selected through a rigorous testing process. Every memory stick is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility.
DARK Za DDR4 GAMING MEMORY
THE BEST SELECTION FOR AMD RYZEN 3000 SERIES
T-FORCE DARK Za DDR4 Gaming Memory is tailor-made for AMD Ryzen 3000 series processor and X570 motherboard. Tested under completed compatibility and stability, which can provide gamers a DDR4 gaming/overclocking memory with excellent quality and optimized performance.
Specification
T-FORCE is TEAM force. The red "T" represents TEAMGROUP’s passion for the storage products. The black "F" represents TEAMGROUP's over 18 years of dedication to storage products. Since we released T-FORCE gaming product line in 2016, we have won multiple product design awards, for example, iF design award, Computex d&i award, Golden Pin design award and Taiwan Excellence. The high quality and extreme performance gaming products from TEAMGROUP allow all gamers to break the speed limit and enjoy the ever-changing world of gaming.
