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Noctua's NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it's air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that's guaranteed to deliver great results. The AM5 edition includes the NA-TPG1 thermal paste guard that prevents thermal paste build-up in the cut-outs of the heatspreader of AMD AM5 CPUs - a simple yet highly effective means to keep your AM5 processor clean.
AM5 Edition with thermal paste guard
When the mounting pressure of the cooling solution is applied, excess thermal paste will be squeezed outwards. With AM5 CPUs, this excess paste tends to accumulate in the cut-outs at the sides of the heatspreader and may become difficult to remove. Simple to apply, the NA-TPG1 prevents this undesired phenomenon.
Easy to clean
| NT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corroding
| While some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there's no risk of short-circuits with NT-H1 and it's completely safe to use with any type of CPU cooler, regardless of whether it's made from copper or aluminium and whether it's nickel-plated or not. |
Excellent long-term stability
| NT-H1's unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound's exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applications
| Sufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4, 15 for AM4/AM5 or LGA1700, and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
| Products | ||||||
|---|---|---|---|---|---|---|
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound |
| Weight/Size | 3.5g | 3.5g | 3.5g | 10g | 3.5g | 3.5g |
| Volume | 1,4 ml | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 1,2 ml |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ |
| NA-CW1 Wipes | - | 3x included | - | - | 3x included | 3x included |
| Spatula Included | - | - | - | - | - | |
| Thermal Paste Guard for AMD AM5 | - | - | - | - |
