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CS-FLUX reballing Low viscosity liquid flux for BGA component rework reflow 15g . Ideal for VGA GPU repairs
- When CS-FLUX heated at around 150 degrees (Celsius) turns into liquid and covers the small gap between the BGA component and the PCB complitelly. This way all solder balls are covered.
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This product does not include manufacturer warranty when purchased or used outside of its designated sales region. By purchasing internationally, you acknowledge that warranty support from the manufacturer will not be available.
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