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S$13.52
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Ships from United States.
Most customers receive within 9-17 days.
Meet Your Seller
Gelid Solutions GC-4-3.5g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive
- Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission critical applications.
- Ultra-Durable & Non-Curing Stable performance under a wide range of temperatures, ranging from -30 to 150 C
- Ensure ultimate conductivity GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to endure ultimate conductivity. perfect gap filling and optimal viscosity.
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Overview
Specs
Reviews
GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.
Created for professional and extreme users to provide the best thermal interface and to achieve ultra-efficient heat transfer from your CPU, GP and Chipset in mission critical applications.
Created for professional and extreme users to provide the best thermal interface and to achieve ultra-efficient heat transfer from your CPU, GP and Chipset in mission critical applications.
Warranty & Returns
Warranty, Returns, And Additional Information
Return Policies*
- Return for refund within: 30 days
- Return for replacement within: non-replaceable
- This item is covered by Hot Deals 4 Less Return Policy
- *Subject to applicable law
Warranty Notice:
This product does not include manufacturer warranty when purchased or used outside of its designated sales region. By purchasing internationally, you acknowledge that warranty support from the manufacturer will not be available.
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