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Bitspower Summit Pro X4677 POM Edition for Xeon LGA 4710 4677 BPM-EP4677-G5

  • Enterprise-Grade Cooling for Intel Xeon
  • Injected Flow + Fin Array Cold Plate
  • Nickel-Plated Copper Base
  • POM Acetal Black Top
  • Polished Chrome Frame
  • Multiple G1/4" Port Configurations
  • Spring-Loaded Retention Mechanism
  • Includes Bitspower TP-1 Thermal Compound
  • No RGB
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Overview
Specs
Reviews

Bitspower Summit Pro X4677 POM Edition for Xeon LGA 4710/4677


Enterprise-Grade Cooling for Intel Xeon

Engineered for the extreme thermal demands of high-performance computing, the Bitspower Summit Pro X4677 POM Edition delivers uncompromising cooling for Intel Xeon workstation and server processors. Built to handle the massive heat output of the LGA 4710 and LGA 4677 sockets, this block combines a massive cooling footprint with industrial-grade durability.

Designed to support long-duration workloads, the POM (Polyoxymethylene/Acetal) top provides a robust, crack-resistant housing ideal for dense server racks and multi-GPU workstations where function and durability take absolute precedence. With its low-profile design and flexible port configuration, the Summit Pro X4677 is the definitive thermal solution for professional-grade Intel platforms.

Key Features

Injected Flow + Fin Array Cold Plate: High-velocity coolant flow directly over the heat source is paired with a dense fin array to maximize thermal transfer efficiency across the large Xeon die area

Nickel-Plated Copper Base: Nickel-plated copper cold plate ensures optimal surface contact and long-term corrosion resistance

POM Acetal Black Top: Durable, chemically resistant black POM acetal top cover for a clean, purposeful aesthetic suited to professional workstation builds

Polished Chrome Frame: CNC-machined chrome-finish frame adds structural rigidity and a premium finish

Multiple G1/4" Port Configurations: Five threaded G1/4" ports offer flexible inlet/outlet routing to suit any loop layout

Spring-Loaded Retention Mechanism: Tool-assisted spring clip mounting system ensures consistent, even clamping pressure across the IHS for repeatable thermal performance

No RGB: Clean, professional appearance with zero lighting distractions, ideal for data center, workstation, and rack-adjacent builds

Includes Bitspower TP-1 Thermal Compound (2.5g): High-performance thermal paste included for immediate installation

Specifications

Model: Summit Pro X4677 POM Edition (actual product name)

Compatibility: Intel Xeon LGA 4710 / LGA 4677

Dimensions: 118 × 78 × 27.6 mm

Cold Plate Material: Nickel-plated copper

Internal Structure: Injected Flow + Fin Array

Top Material: POM acetal (black)

Frame Material: Chrome-finished metal

Port Threading: G1/4"

Number of Ports: 5

Lighting: None

Included Accessories: Bitspower TP-1 Thermal Compound (2.5g), mounting hardware

Warranty & Returns

Warranty, Returns, And Additional Information

Return Policies*

  • Return for refund within: 30 days
  • Return for replacement within: non-replaceable
  • This item is covered by Bitspower Return Policy
  • *Subject to applicable law
  • Warranty Notice:

    This product does not include manufacturer warranty when purchased or used outside of its designated sales region. By purchasing internationally, you acknowledge that warranty support from the manufacturer will not be available.

Manufacturer Contact Info

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