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StarTech.com 20g Tube CPU Thermal Paste Grease Compound for Heatsinks Cooling - White (HEATGREASE20)
- Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler
- Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer
- Ceramic-based compound that is electrically non-conductive, for safe use around electronics
- Ceramic-based compound containing silicone
- Thermal conductivity of more than 1.066 W/m-K
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Overview
Specs
Reviews (43)
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone
Warranty & Returns
Warranty, Returns, And Additional Information
Return Policies*
- This item is covered by Newegg.com's Iron Egg Guarantee Return Policy.
- Read full return policy for details.
- *Subject to applicable law
Warranty Notice:
This product does not include manufacturer warranty when purchased or used outside of its designated sales region. By purchasing internationally, you acknowledge that warranty support from the manufacturer will not be available.
Manufacturer Contact Info
- Manufacturer Product Page
- Manufacturer Website
- Support Phone: 1-800-265-1844
- Support Email: support@startech.com
- Support Website
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StarTech.com HEATGREASE20 is a 20 g, white ceramic-based thermal paste for improving heat transfer between a CPU and heatsink, suited to PC builders and technicians who want a non-electrically-conductive compound for electronics.
Recommended For
- System builders assembling multiple entry-level to mainstream home or business PCs who want one 20 g tube for repeated CPU cooler installations.
- PC repair technicians replacing old or dried thermal compound when removing and reinstalling a CPU heatsink.
- Home or office PC maintainers servicing standard CPU cooling setups who prefer a ceramic-based, electrically non-conductive compound.
- Users with several heatsink-to-component applications who need a tube intended to cover many light-duty thermal-bonding jobs.
Spec Summary
| Attribute | Value |
|---|---|
| Best For | Applying a ceramic-based thermal compound between a CPU and heatsink |
| Thermal Performance | Thermal conductivity greater than 1.066 W/(m·K); thermal resistance below 0.195 °C·m²/W |
| Composition And Appearance | White ceramic-based compound containing silicone; materials comprise 50% silicone compounds, 20% carbon compounds, and 30% metal oxide compounds |
| Stability | Bleed below 0.05% and evaporation below 0.001% at 200°C over 24 hours |
| Package And Model | 20 g tube; StarTech.com model HEATGREASE20 |