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Main image of Dynatron Q7 1U Copper Vapor Chamber Heatsink with Stacked Fins for LGA 1700 Socket

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Dynatron Q7 1U Copper Vapor Chamber Heatsink with Stacked Fins for LGA 1700 Socket

Supports Intel Alder Lake-S Socket LGA 1700
Copper Vapor Chamber Heatsink with Stacked Fins
Supports up to 125W TDP
Pre-applied Shin-Etsu 7762 Thermal Grease
Dimensions: 3.74" x 3.7" x 1.11"

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Recommend for Intel Alder Lake S Processor, Socket LGA 1700, Copper Vapor Heatsink with Stacked Fins. Support 125 Watts CPU Power Heat Dissipation for 1U & Up Server Solution.

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Item#: 9SIA2W0KAV9044