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Zalman STC 9 Thermal Compound Paste for All CPU Cooler, 4g, Heat Sink Paste, Composed of Carbon Micro-Particles, East to Apply, High Durability, 4g

  • Excellent Stability: Zalman STC 9 effective thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity.
  • Measuring Graduations for convenience: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
  • Optimum Viscosity: Particle size technology provides optimal filler density to conveniently use on any type of computer chips.
  • East to use and store: Syringe type which is easy to use and rubber-cap prevents liquid content from being hardened over a period of time when reused
  • Outstanding Durability and cooling performance: STC 9 can fill up space between the heatsink and CPU to maximize cooling performance &RoHS Certified
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Overview
Specs
Reviews
ZM-STC9
ZM-STC9
  • Measuring Graduations for Convenience
  • Easy to Use and Store
  • Best Cooling Performance
  • Optimum Viscosity
ZM-STC9
  • Rubber Cap
  • Measuring Graduations
ZM-STC9
All Materials Included are Environmentally Safe and Harmless

ZM-STC9 does not affect electrical conductivity in the system. It uses environmentally safe and harmless materials that follows Restriction of Hazardous Substances (RoHS) compliance.

ZM-STC9
High Thermal Conductivity ZM-STC9
Products
Dimensions(Syringe) 117.4(W) x 21.2(L) x 15(H)mm 66(W) x 19(L) x 12(H)mm 117.4(W) x 21.2(L) x 15(H)mm
Weight 4g 1.5g 4g
Thermal Conductivity 7.2 W/mK 8.3 W/mK 9.1 W/mK
Viscosity 220 Pa.s 350~480 Pa.s 250 Pa.s
Specifications
Model ZM-STC9
Dimensions (Syringe) 117.4 (W) x 21.2 (L) x 15 (H) mm
Weight 4g
Color Gray
Thermal Conductivity 9.1 W/m·K
Density 2.7g/cm3
Viscosity 250 Pa.s
Materials Silicone Oil, Alumina, Aluminum, Zinc Oxide

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