Original UX PRO Ultra 16.8 W/m.K 20g Thermal Putty VGA GPU IC Processor Cooling Thermal Pad CSGR

UX PRO Ultra is a viscous thermal paste designed for thermal pad replacement, often referred to as Liquid Thermal Pad or Thermal Putty. Developed and produced by the Computer Systems Research department in Thessaloniki, Greece, it can replace thermal pads up to 3.5 mm thick. Its high viscosity makes it ideal for thermal pads ranging from 1mm to 3.5 mm thick. This offer includes a 1 x 20g packet, providing enough quantity for up to 10 applications. Additionally, the packet includes a plastic spatula and 2x finger sleeves.
Applications: Automotive Electronic Control Units Heat sink, Memory modules LED Lighting, LCD-TV Military Electronics Power Supplies Telecom services Wireless instruments Automotive control services
Storage Information: UX PRO Ultra offers infinite storage/service life. It doesnt dry out. Store in a closed can and protect from frost and dust. Made in Greece (European Union). Computer Systems materials science laboratory testing: A comparative technique (P. Karydopoulos, P. Frantzis, N. Karagiannis MSAIJ 2014) was used to determine the combined thermal conductivity when replacing a 1.5 mm thick thermal pad with UX PRO Ultra combined with a 1mm thick copper pad. When to Replace Thermal Paste/Pads in
Your Computer: Thermal paste and thermal pads should be replaced every time the heat sink is removed (for cleaning, upgrade, or other maintenance). It's crucial to replace the thermal pads and gummy thermal paste used by many manufacturers on the memory chips when the heat sink is removed. Reusing the same thermal pads or paste may prevent the heat sink from fitting perfectly again, leading to overheating and component failure. If your computer overheats or shuts down after a few hours of use, the entire heat sink system must be cleaned immediately, and all thermal paste and thermal pads must be replaced.