16gb 2rx8 ddr4-2400mhz sodimm memory

Search Within:

Page 20/20

Sort By:Featured Items

Compare

Compare

Compare

Compare

Buffered/Registered: Unbuffered
Features: Compatibility: HP Compaq Elite 8300 (ultra-slim desktop) HP 6360t Mobile Thin Client HP EliteBooks: 2560p 2760p 8460p 8460w 8560p 8560w 8760w HP ProBooks: 4530s 6360b 6460b 6465b 6560b 6565b
Model #: B4U40AA-AX

Compare

CAS Latency: CL11
Voltage: 1.35V
Buffered/Registered: Unbuffered
Features: JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V) Power SupplyVDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)800 MHz fCK for 1600 Mb/sec/pin8 independent internal banksProgrammable CAS Latency: 11, 10, 9, 8, 7, 6Programmable Additive Latency: 0, CL-2, or CL-1 clock8-bit pre-fetchBurst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]Bi-directional Differential Data StrobeInternal(self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm +/- 1%)On Die Termination using ODT pinAsynchronous ResetPCB: Height 1.18" (30mm), double sided component MEM_Recommend Use:
Model #: KVR16LS11/8.

Compare

Brand: NEMIX RAM
Series: NEMIX RAM DDR3 Orignial Series 204-Pin NON-ECC Unbuffered SODIMM Memory
Capacity: 8GB
Type: 204-Pin DDR3 SO-DIMM
Model #: MS14900-828K01-2523

Compare

CAS Latency: CL22
Voltage: 1.20V
Features: Axiom's DDR4 Modules use the latest evolutionary DRAM design, provides improved speed, power management and reliability. The release of DDR4 delivers an overall performance improvement of up to 30% for single DIMM configurations. DDR4 performance scales up to 65% faster in 3-DIMM per channel (3DPC) applications over DDR3. High bandwidth and faster data rates combined with lower voltage demands deliver the most compelling and significant DRAM computing update in the past decade. DDR4 Features: 100% Increase in speed - Faster Data Rate equates to more responsive application loads on data-intensive programs. 300% increase in component densities - Equals larger modules for next-generation performance demands. 20% decrease in power consumption - Less power consumed means less wasted resources to cool systems ...
Model #: AB175259-AX