Pros: Running windows 8 64 bit Processor Calculation per second Subscore 7.8 six core 1090t 3.8 ghz Memory (RAM) Memory operations per second Subscore 7.8 8gig DDR2 800 Graphics Desktop graphics performance Subscore 7.9 Nivida GTX 480 Gaming graphics 3D business and gaming graphics performance Subscore 7.9 GTX 480 Primary Hard disk Subscore 7.3 Intel SSD Creative Sound Blaster THX Klipsch speakers Liteon blu ray Sniper computer case Cinebench Release 11.5 1090t 3.83 GHz score 6.64 GTX 480 42.53 3D Mark11 P5430 Age of board over 4 years

Cons: Zero

Pros: 22nm less power but read cons

Cons: Ivy Bridge's temperatures is reportedly 20°C higher compared to Sandy Bridge when overclocked, because instead of using fluxless solder to transfer heat from the die to the Integrated Heat Spreader (IHS), Intel used Thermal Interface Materials (TIM) to cut cost. The thermal paste has much lower thermal conductivity, causing heat to build up on the die.[19][20][21] Intel has said that overclocking the CPU will result in higher temperatures due to the fact that with the die shrink, there is an increased thermal density; Intel at the same time stated that this is as expected and will likely not improve in future revisions

Overall Review: none

Pros: Last October 29, Nvidia reduced the retail price of its flagship card GTX 780 from $649 to $499. The Kepler technology- powered GTX 780 was only released last May 2013 and the surprisingly big $150 price slash seeks to undercut the new Radeon 9 series 290x graphics card from Advanced Micro Devices, Inc. (AMD). Nvidia also slashed the price of its GTX 770 from $499 to $329 as a direct competition for AMD's new mid-range $299 280x graphics card. Although with a higher retail price, the GTX 770 is also eligible for the free games and $100 discount on SHIELD, making it a better value deal than AMD's product.

Cons: That why you wait when you buy them right when they come out you get rip big time

Pros: 22nm power

Cons: Ivy Bridge's temperatures is reportedly 20°C higher compared to Sandy Bridge when overclocked, because instead of using fluxless solder to transfer heat from the die to the Integrated Heat Spreader (IHS), Intel used Thermal Interface Materials (TIM) to cut cost. The thermal paste has much lower thermal conductivity, causing heat to build up on the die.[19][20][21] Intel has said that overclocking the CPU will result in higher temperatures due to the fact that with the die shrink, there is an increased thermal density; Intel at the same time stated that this is as expected and will likely not improve in future revisions

Pros: 22nm power low

Cons: Ivy Bridge's temperatures is reportedly 20°C higher compared to Sandy Bridge when overclocked, because instead of using fluxless solder to transfer heat from the die to the Integrated Heat Spreader (IHS), Intel used Thermal Interface Materials (TIM) to cut cost. The thermal paste has much lower thermal conductivity, causing heat to build up on the die.[19][20][21] Intel has said that overclocking the CPU will result in higher temperatures due to the fact that with the die shrink, there is an increased thermal density; Intel at the same time stated that this is as expected and will likely not improve in future revisions

Pros: 22 nm power less but

Cons: Ivy Bridge's temperatures is reportedly 20°C higher compared to Sandy Bridge when overclocked, because instead of using fluxless solder to transfer heat from the die to the Integrated Heat Spreader (IHS), Intel used Thermal Interface Materials (TIM) to cut cost. The thermal paste has much lower thermal conductivity, causing heat to build up on the die.[19][20][21] Intel has said that overclocking the CPU will result in higher temperatures due to the fact that with the die shrink, there is an increased thermal density; Intel at the same time stated that this is as expected and will likely not improve in future revisions

Overall Review: none