The 300 Series Gaming WIFI Motherboards implement the Intel® Wireless-AC 9560 module with integrated Intel® 802.11ac Wave 2 CNVi Wi-Fi, which supports MI-MUMO 802.11ac and Bluetooth 5.0, delivering the next-gen wireless connectivity when paired with 8th Gen Intel® Core™ Processors.

The 2x2 802.11ac Wi-Fi Wave 2 is optimized for faster download speeds even under dense network traffic, doubling the throughput of previous generations and delivering speeds up to 1.72Gbps.

The MU-MIMO supports multiple simultaneous connections means users can maximize their network connectivity while multitasking, streaming, or gaming.

The redesigned M.2 Heatsinks on these AORUS GAMING 3 WIFI motherboards take storage performance to the next level. One of the slots is protected by a M.2 Thermal Guard limiting the effect of thermal throttling and allowing for transfer speeds up to 32Gbps.

Each of the two M.2 slots utilize specially designed GIGABYTE dual slot mode which automatically detects and switches between SATA and PCIe mode for an easier building experience. Rounding out the enhanced connectivity of the new H370 and B360 motherboards is Intel® Optane support and native USB 3.1 Gen 2 ports with transfer speeds up to 10Gbps.

Different models have different number of fan pin headers and temperature sensors. Smart Fan 5 function may vary by model.

With Smart Fan 5 users can ensure that their gaming PC can maintain its performance while staying cool. Smart Fan 5 allows users to interchange their fan headers to reflect different thermal sensors at different locations on the motherboard. Not only that, with Smart Fan 5 more hybrid fan headers that support both PWM and Voltage mode fans have been introduced to make the motherboard more liquid cooling friendly.

With the help of RGB Fusion software, Smart Fan 5 works in tandem to provide an additional visual sense that allows system temperatures to illuminate directly through your system's lighting for added system intelligence.

AORUS H370 series motherboards use a 8+2 phase PWM+ Lower RDS(on) MOSFETs design to support the latest Intel® 8th Gen Core™ Processors. By utilizing high quality Intersil components our H370 is able to offer incredible precision under heavy workloads and gaming, optimized switching for better thermal performance, while still offering high efficiency at lower power states.


Copyright © 2018 GIGABYTE Technology Co. Ltd., All rights reserved. All trademarks referenced herein are the properties of their respective owners. Product specifications, terms and conditions are subject to change without any prior notice. Features may vary by models.

All prices reflect the final price after savings/rebate(s).

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