Efficient Thermal Conductivity The silicone based material of the Thermal Pads outperforms generic pads by far by providing an efficient thermal interface between heat sinks and electronic devices. Filling the Gaps Due to its great elasticity and compressing features, the thermal pad works as the perfect gap filler and bridges uneven surface topography, air gaps and rough surface textures without any problems.
Why use thermal silicone Pad ?
The main purpose of the choice of Thermal Pad is to reduce the heat source surface and the heat dissipation device contact surface between the contact thermal resistance. Thermal conductivity of silicone Pad can be good filling the gap between the contact surface;
Because the air is hot bad conductor, will seriously hinder the heat transfer between the contact surface, And in the heat source and the radiator between the installation of thermal silica Pad can be out of the air contact surface;
With thermal silicone Pad supplement, you can make the heat source and the heat sink between the contact surface better full contact, Truly face to face contact in the temperature of the reaction can be achieved as small as possible temperature difference.
Parameter:
- Color:Gray
- Thermal Conductivity:13.8W/M-K
- Density:3.3+-0.1
- Hardness:40-80(Sc)
- Breakdown Voltage:>6KV/Mm
- Temperature Range:-40Celsius~200Celsius
- Executive Standard:Q/ZHDZ004-2016
Package:Qnplum QMG138 120*120*0.5 MM Thickness Thermal Pad
Qnplum QMG138 Thermal Pad High-performance
The thermal pads applied high-performance thermal conductive materials to eliminate air gaps, thereby improving the overall thermal conversion capability and enabling the device to work at a lower temperature, We are committed to providing high-quality thermal pads, easy to install.
Main Features
Thermal pad has 13.8 W/mK Thermal Conductivity, Used to fill the gap between the heating element and the Heatsink, Achieve the best cooling effect. At the same time, the thermal pad also has Insulation, Non-conductive, wear-resistant, fire-retardant, compression, buffering, no damage to metal materials, etc effect.
Scissors cutting
0.5mm Thickness Thermal Pad you can freely cut the thermal pads according to your needs, perfectly fill the contact surface gap, is a good helper for beginners and professionals who use Qnplum QMG138 thermal pad.
Easy installation
Unlike other thermal adhesives, the Qnplum QMG138 13.8 W/mK cooling pad is super easy to use. Just remove the plastic film, paste it on the surface, gently press, remove the film from the other side and install the system.
| Thermal Conductivity: | 13.8W/M-K |
|---|---|
| Hardness: | 40-80(Sc) |
| Breakdown Voltage: | >6KV/Mm |
| Thickness: | 0.5mm |
| Color: | Gray |
| operating temperature: | -40Celsius to +200Celsius |
One Pad , multi-purpose, durable,insulated, non-conductive.
Silicone-Based Paste Is Common in Thermal Pads
Silicone-based thermal compound is common in cooling kits and thermal pads, which are easier to apply than regular compound. It is best to choose a non-adhesive silicone paste, so you will be able to remove or replace your heatsink easily if needed.
Wide Range of Applications
electronic products, motherboard, motor, external pad and foot pad, electronic, appliances, high power LED lighting, Car machine, power devices, automotive electronic modules (engine scrubber) Power modules, high power power supplies, computer host (CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard drives) ,laptop and any electronic equipment needing to be filled with heat dissipation.
Wide operating temperature range: Qnplum QMG138 13.8 W/mK thermal adhesive pad has an operating temperature of -40Celsius to +200Celsius, making it compatible with a wide range of applications such as chipsets, laptops, GPU cards, and microcontroller units.
step 1
- Wipe the surface of the cpu
- Remove rust,dust and oil
- Keep the contact surface with the thermal pad clean
step 2
- Tear off the film on the back of the thermal pad
- Place it flat on the chip
step 3
- Gently peel off the film
- Don't touch the surface
step 4
- Install the radiator
- Give the radiator a certain downward pressure
- Avoid air bubbles, which will affect the thermal conductivity of the product
| Products | ||||||
|---|---|---|---|---|---|---|
| Size: | 40*40*0.5mm | 120*20*0.5mm | 30*30*0.5mm | 90x60x0.5mm | 120x120x0.5mm | 145×145×0.5mm |
| Thermal Conductivity: | 13.8W/M-K | 13.8W/M-K | 13.8W/M-K | 13.8W/M-K | 3.0W/M-K | 6.0W/M-K |
| Density: | 3.3±0.1 | 3.3±0.1 | 3.3±0.1 | 3.3±0.1 | 3.5(g/cm³) | 3.2 g/cm³ |
| Hardness: | 40-80(Sc) | 40-80(Sc) | 40-80(Sc) | 40-80(Sc) | 18-40(Sc) | 25(Sc) |
