The LEPA LV12 cooler, compatible with AMD and Intel platforms, delivers a great blend of performance and silence that takes the cooling to the next level. An innovation in this model is the louver fin design, which creates a "U"-shaped airflow and forces the air to take more heat than standard fins. Four 6mm copper heatpipes and perfectly spaced aluminum fins with oxidation-resistant coating work together to remove the heat from CPU rapidly and efficiently. A 120mm fan blows cool air over the fins to dispel the heat. The fan can be configured with three selectable peak RPM settings to match your usage scenario. Best of all, the cooler comes in a slim design, avoiding any blockage when you install high-end memory modules with a high-profile heatspread.
Compatible with Intel LGA 775/1155/1156/1366/2011/1150, and AMD AM2/AM2+/AM3/AM3+/FM1/FM2/FM2+.
- Louver DesignThe louver design helps the airflow movement into a "U"-shaped aluminum fin to increase the path of thermal conductivity. The louver fin breaks the thermal boundary layer to increase heat exchange rate.
- Superior ContactFour Ø6 mm copper heatpipes with exclusive H.D.T. (Heatpipe Direct Touch) Technology ensure rapid thermal conduction and eliminate CPU hot spots.
- Premium Heatsink BuildS.N.T.C (Super Nano Thermal Conductive) coating protects the heat sink from oxidation, keeps excellent heat transfer efficiency, and extends the life expectancy of the cooler. Sophisticated fin gap calculation leads to the ultra balancing between fan speed and heat transfer efficiency.
- Unique APS ControlIntelligent APS (Adjustable Peak Speed) control of the cooling fan directly provides three peak RPM selections for user preferences. Three settings include Silent (800-1500 RPM), Performance (800-1800 RPM), and Overclocking (800-2200 RPM), with respective fan noise of 8 ~ 17/20/23 dBA.
- BOL BearingThe Barometric Oilless (BOL) Bearing allows for a long life span and silent spinning.
- Memory FriendlyThe slim heat sink tower design increases RAM installation flexibility.