Alphacool Apex Thermal Putty X1 - 30g, 10W/mk, Grey (14828)

The Alphacool Apex Thermal Putty X1 - 30g is 30 g of blue-gray, non-curing silicone thermal putty with a thermal conductivity of 10 W/mK. It is a gel for thermally bonding heat-sensitive electronic components to the heatsink, and an electrically non-conductive alternative to traditional thermal pads. The larger size is the 50g putty.

Properties

• Thermal conductivity: 10 W/mK (ASTM D5470)
• Weight: 30 g
• Minimum bond line thickness: 0.2 mm
• Continuous operating temperature: -20 to 125 °C
• Color: Blue-gray

What it is for

Alphacool calls the putty a high-performance solution. It says the putty was specifically developed for applications where flexibility, low mechanical stress and high thermal conductivity are crucial. It names modern graphics cards and other sensitive electronic components as the place where this is particularly important. There the putty protects delicate components such as memory chips and voltage regulators from damage.

Consistency and stability

A key advantage, according to Alphacool, lies in the optimal consistency for processing and the dimensional stability. Under slight pressure the material conforms to varying gap heights while maintaining its shape, perfectly so in Alphacool's words. This allows for reliable compensation of unevenness and tolerances between the cooler and component, ensuring what Alphacool calls optimal contact between the heat source and the heatsink at all times.

Bond line thickness

Bond line thickness (BLT) describes the thickness of the thermal interface material layer between the component and the heat sink. Alphacool says its sophisticated formula design combines high thermal conductivity with a reduced BLT, thereby lowering thermal resistance and improving heat dissipation. Simultaneously, it says, the high vertical stability combined with long-term stable material properties ensures lasting material integrity without sagging, cracking or contamination of adjacent components. Alphacool sees that making the product ideal for professional applications.

Where it is used

These properties result in a wide range of applications. Wherever reliable, flexible and mechanically gentle heat transfer is required, Alphacool offers the Apex Putty as a future-proof solution.

Technical Data

• Flow Rate (g/min): 20 (Test method: 30 cc EFD cartridge / 2.5 mm nozzle, 90 psi)
• Density (g/cc): 3.8 (Test method: ASTM D792)
• Minimum bond line thickness (mm): 0.2 mm
• Continuous operating temperature (degrees Celsius): -20 to 125 °C
• Thermal conductivity (W/mK): 10 (Test method: ASTM D5470)
• Volume resistivity (Ohm·cm): 1.0 × 10¹³ (Test method: ASTM D257)
• Dielectric strength (kV/mm): 5 (Test method: ASTM D149)
• Weight: 30 g
• Color: Blue-gray

In the box

• 1x Apex Thermal Putty X1 - 30g