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Biostar TC-DIAMOND Nano Diamond Thermal Compound

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Specs
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Learn more about the Biostar TC-DIAMOND

Model
Brand Biostar
Model TC-DIAMOND
Details
Specifications Thermal Conductivity: >3.8 W/m-K
Thermal Resistance: <0.087°C -in2/W
Specific Gravity: >2.5
Operating Temp.: -50°C to 240°C
Weight: 1.5g
Ingredient: Silicone Compounds 50%, Carbon Compounds 20%, Metal Oxide Compounds 20%, Diamond Particle 10%
Features
Features Biostar Nano Diamond Thermal Compound is an ultra conductive thermal compound which is speacially blended for hi-performance heatsinks.

The featured ingredient of Biostar Nano Diamond Thermal Compound is Nano Diamond whose well-known characteritics are high thermal conductivity and complete insulation.

It only takes a small amount for each application to greatly enhance the performance of heatsink.

Besides, Biostar Nano Diamond Thermal Compound is totally free from the possibly electric conduction of those metallic based thermal compound.

Biostar Nano Diamond Thermal Compound is an optimal choice for the best performance and safety purpose.
Additional Information
Date First Available December 07, 2010

Warranty & Returns

Warranty, Returns, And Additional Information

Warranty

  • Limited Warranty period (parts): 1 year
  • Limited Warranty period (labor): 1 year
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