Out of stock

This item is currently out of stock and it may or may not be restocked.

Out of Stock

Add to wish list(Found on 1 wish list)

Sold by Newegg

Shipped by Newegg

Get Educated

Make informed decisions with expert advice. Learn More

Images from RETAIL item, box contents may vary.

Enermax ETS-T50 Axe ARGB CPU Air Cooler, 230W+ TDP for Intel/ AMD Universal Socket, AM4 & AM5 / LGA 1700/1200/1151, 5 Direct Contact Heat Pipes, 120mm PWM Fan - AM5 & LGA1700 Ready

OPEN BOX

Support up to 230W+ TDP
High pressure blade design (max. 3.07 mm-H2O)
Patented Rotatable Air Guide
Support addressable RGB motherboard sync
Plug & Play to display the rainbow RGB lighting effect, no software or adaptor needed
LGA 1700 brackets included inside the package

The Open Box Product Disclaimer applies to this product. Please note that this product is non-returnable and non-refundable.

Specs

Any questions? Our AI beta will help you find out quickly.

Try me now

Learn more about the ENERMAX ETS-T50A-BK-ARGB

Details
Color	Black
Type	Fan & Heatsinks
Fan Size	120mm
CPU Socket Compatibility	Intel LGA 2066 / 2011-3 / 2011 / 1700 / 1366 / 1200 / 1156 / 1155 / 1151 / 1150 AMD AM5 / AM4 / AM3+ / AM3 / AM2+ / AM2 / FM2+ / FM2 / FM1
Bearing Type	Twister Bearing
RPM	500 - 1600 (+/-10%) RPM
Air Flow	23.81 - 71.32 CFM
Noise Level	14 - 24 dBA
Power Connector	4 pin PWM connector 3-pin ARGB connector (5V/D/-/G)
LED	Addressable RGB
Heatsink Material	Copper Heat Pipes / Aluminum Fins
Fan Mounting Types to Heatsink	Vertical

Features
Features	Synchronize RGB lighting via addressable RGB headers (5V/D/-/G) of motherboards from ASUS Aura Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync and ASRock Polychrome PWM power cable to connect the fan to create constant rainbow RGB lighting effects, no software or adaptor needed High pressure blade design is a precision engineering of the blade angle and shape calculation Patented air guide with rotatable grill for preferred airflow direction Patented Pressure Differential Flow (PDF) design uses differential wind pressure to increase 15% more airflow Patented Vortex Generation Flow (VGF) design to increase air convection around the heat pipe Unique air path creating high Vacuum Effect (VEF) to optimize airflow Heat-pipe Direct Touch (HDT) technology to ensure rapid thermal conduction and eliminate CPU hot spots Asymmetric heat pipe design allows extra space for ideal RAM compatibility

Additional Information
First Listed on Newegg	October 16, 2020

Return for refund within: This item is Final Sale
Return for replacement within: This item is Final Sale
This item is covered by Newegg.com's Final Sale Return Policy. Read full return policy for details.