As the CPU power consumption increases, the heat dissipation requirements of a PC are increasing. HX6250 adopts 6 heat pipe single tower design, full copper bottom brazing process with whole body graphene coating, turbulent performance instantly cool, design power consumption optimization to TDP
Non-blocking Memory
6 Heatpipe Single Tower Design
14CM High Flow Fan
Graphene Spraying Assists Heat Dissipation
Come With CTG Thermal Grease
Lower Noise Greater Air Volume
Large tower body USES the crooked neck structure design, no block to memory, no longer suppress, bloom more brilliance.
Standard speed reduction line and noise free choice
The bottom of the copper brazing process
All the bottom of the copper brazing process supplemented by general graphene coating
Effectiveness of instant ice fury
All blackened coating treatment
50 layers of cooling fins
Total 6289cm2 heat dissipation area
Magnetic disassembly, all aluminum wire drawing texture
Single Tower Volume
Twin Tower Performance
Accurate Heat Dissipation
Greatly Enhance the Heat Dissipation Efficiency
Compact Body Strong Load
14CM 6 Heatpipe Tower Radiator
