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LS4 Intelligent Multi-function heating Glue removal and layering heating machine for tinning, chip glue removal,mainboa
- Suitable for tinning, chip glue removal, separation preheating, mainboard layering, etc
- Modular design,Strong compatibility, can be switched freely according to needs
- Large operating area, supports larger motherboard desoldering operations, convenient and fast
- CNC precise temperature adjustment, starting from the current ambient temperature - up to 380
- Specially made thickened aluminum plate, rapid heating, even heating, fast and efficient repair
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Suitable for tinning, chip glue removal, separation preheating, mainboard layering, etc. Modular design, Strong compatibility, can be switched freely according to needs. Large operating area, supports larger motherboard desoldering operations, convenient and fast. CNC precise temperature adjustment, starting from the current ambient temperature - up to 380. Specially made thickened aluminum plate, rapid heating, even heating, fast and efficient repair
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Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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Return Policies
- Return for refund within: 30 days
- Return for replacement within: 30 days
- This item is covered by Zhiyi Technology Return Policy
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