Desoldering Station Tem.
Range: 662-896°F Temp.
Stabilization: PID
Program Solder Extraction: Vacuum
Pump Nozzle Sizes: Ø 0.8 / 1.0 / 1.2 / 2.0 mm
Suction Pressure: 0.05M pa
Preset Channel: 3 Available Channels Soldering Station Temp.
Range: 392-896°F Temp.
Stabilization: PID
Program In-Holder Sleep Mode: Yes
Adjustable Sleep Mode Timer: Yes
Preset Channel: 3 Available Channels Hot Air Rework Station Temp.
Range: 212-896°F Temp.
Stabilization: PID Program Temp.
Stability: ± 1.8 °F
Air Volume: 120L Max.
Automatic/Manual Hot Air Modes: Yes
Preset Channel: 3 Available Channels Suction Pen (Extraction)
Suction Pressure: 0.05M pa
Independent ON/OFF: Yes Suction
Pad Size: Ø 3.0 / 6.5 /10mm
Compatible IC Types: BGA, PLCC, SOIC, QFP, and more