Feature
This heating station is equipped with built-in CPU to controls the temperature.
And aluminum alloy plate on the top has thermal conductivity to ensure even temperature.
This product is suitable for component heating, SMD reengineering, PCB removing and soldering.
Specifications
:
Voltage: AC 110 ±10%
Power: 850W
Temperature range: 30-400 ° C
Temperature display: 3 bites(display resolution: 1 °C)
Constant temperature stability: ± 1.5 - 0 °C
Heating plate size: 200*200mm/ 7.87 * 7.87 in
Dimensions: 21.5 * 21.5 *14cm/ 8.46 * 8.46 * 5.51 in
Package weight: 3287g
Temperature Range
300-400°C {Mold core preheating, various metal materials}
200-300°C {BGA balling}
200-250°C {LED lamp bead welding, maintenance}
150-200°C {Preheating for electronic circuit board repairing}
80-120°C {Melting glue, removing the screen of the mobile phone}
30-100°C {Laboratory reagent heating}
30°C {Warming medical experiment, cell culture, liquid}