All essential soldering materials included. No need to purchase separately. Perfect for efficient and convenient repair work
TH-338 High-Activity No-Clean Lead-Free Solder Flux
This Lead-Free No-Clean Flux Paste Provides Excellent Wetting Performance And Effectively Removes Oxide Layers From Soldering Surfaces. It Improves Solder Flow, Enhances Joint Reliability, And Reduces The Risk Of Cold Solder Joints.
Precise Control & Low Residue Formula Designed With Smooth Dispensing Control, The Soldering Flux Ensures Accurate Application And Minimizes Waste. The Low-Residue Formula Leaves Minimal Post-Soldering Contamination, Making It Ideal For PCB Repair, BGA Rework, SMD, And Electronic Assembly.
TH-3019 217°C High-Temperature Lead-Free Solder Paste
Formulated With Sn99/Ag0.3/Cu0.7 Alloy, This High-Temperature Soldering Paste Offers A Stable Melting Point Of 217°C (423°F). It Provides Smooth Solder Joints, Strong Bonding Strength, And Consistent Performance During Reflow Soldering.
Stable Reflow Performance & Clean Soldering The Solder Paste Delivers Excellent Printability And Controlled Solder Flow, Reducing Solder Balls And Bridging. Suitable For PCB, BGA, SMT, SMD, CPU, And LED Soldering Applications.
TH-2530 2.5MM 3M Lead-Free Desoldering Wick
This Solder Wick Braid With Flux Is Made Of High-Purity Oxygen-Free Copper And Coated With Flux, Utilizing Strong Capillary Action To Quickly Absorb Excess Solder For Fast And Efficient Removal.
Efficient Cleaning & Excellent Thermal Conductivity
The Fine Copper Braid Structure Provides Superior Heat Transfer And Ensures Low Residue After Use. Ideal For PCB Repair, Component Replacement, Electronic Maintenance, And Precision Desoldering Applications.
Flux Product information:
Solder Paste Product information:
Solder Wick Product information:
All essential soldering materials included. No need to purchase separately. Perfect for efficient and convenient repair work
TH-338 High-Activity No-Clean Lead-Free Solder Flux
This Lead-Free No-Clean Flux Paste Provides Excellent Wetting Performance And Effectively Removes Oxide Layers From Soldering Surfaces. It Improves Solder Flow, Enhances Joint Reliability, And Reduces The Risk Of Cold Solder Joints.
Precise Control & Low Residue Formula Designed With Smooth Dispensing Control, The Soldering Flux Ensures Accurate Application And Minimizes Waste. The Low-Residue Formula Leaves Minimal Post-Soldering Contamination, Making It Ideal For PCB Repair, BGA Rework, SMD, And Electronic Assembly.
TH-3019 217°C High-Temperature Lead-Free Solder Paste
Formulated With Sn99/Ag0.3/Cu0.7 Alloy, This High-Temperature Soldering Paste Offers A Stable Melting Point Of 217°C (423°F). It Provides Smooth Solder Joints, Strong Bonding Strength, And Consistent Performance During Reflow Soldering.
Stable Reflow Performance & Clean Soldering The Solder Paste Delivers Excellent Printability And Controlled Solder Flow, Reducing Solder Balls And Bridging. Suitable For PCB, BGA, SMT, SMD, CPU, And LED Soldering Applications.
TH-2530 2.5MM 3M Lead-Free Desoldering Wick
This Solder Wick Braid With Flux Is Made Of High-Purity Oxygen-Free Copper And Coated With Flux, Utilizing Strong Capillary Action To Quickly Absorb Excess Solder For Fast And Efficient Removal.
Efficient Cleaning & Excellent Thermal Conductivity
The Fine Copper Braid Structure Provides Superior Heat Transfer And Ensures Low Residue After Use. Ideal For PCB Repair, Component Replacement, Electronic Maintenance, And Precision Desoldering Applications.
Flux Product information:
| Brand Name: | TANG HONG |
| Product Name: | Soldering Flux |
| Model: | TH-338 |
| Material: | Rosin |
| Volume: | 5ML |
| Flux Color: | Milky White |
| Type: | Flux for soldering |
| Application: | Phone PCB BGA SMD Remove |
| Usage: | Electronics Soldering |
| Batteries Included?: | No |
| Batteries Required?: | No |
| Shelf Life: | 5 years |
Solder Paste Product information:
| Brand Name: | TANG HONG |
| Product Name: | Solder Paste |
| Model: | TH-3019 |
| Material: | Sn99%/Ag0.3%/Cu0.7%/Flux11.2% |
| Net Weight: | 16g / 0.57oz |
| Melting Point: | 217 °C ( 423 °F) |
| Type: | Lead-Free Solder Paste |
| Application: | PCB, BGA, SMD, SMT, CPU, LED, Electronic Repair |
| Usage: | Reflow Soldering / PCB Repair / Electronic Assembly |
| Form: | Syringe |
| Batteries Included?: | No |
| Batteries Required?: | No |
| Shelf Life: | 1 years |
Solder Wick Product information:
| Brand Name: | TANG HONG |
| Product Name: | Desoldering wick |
| Model: | TH-2530 |
| Material: | Copper/Flux |
| WID: | 0.1In |
| Length: | 10Ft |
| Type: | Desoldering Item |
| Application: | Remover Solder, Disassemble Electrical Components |
| Usage: | Desoldering |
| Batteries Required?: | No |
| Batteries Included?: | No |
| Shelf Life: | 3 Years |