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    No Clean Solder Paste, Lead Free Soldering Paste Sn42 Bi58 (T3), 138 Melting Point Solder Paste for Electronics in jar (1.76oz/50g)

    • Solder Paste Content: Alloy Tin 42% Bi 58%
    • Product Total Weight: 50g/Can, Net Weight Of Paste: 42g; Particle size: #3 (25-45 microns)
    • #8300 Solder Paste Feature: No clean, Delicate and moist, Bright solder joints, excellent solderability, and no bridging.
    • Low temperature Soldering Paste Melting Point: 138°C (280F)
    • Applications: Suit for LED soldering, Commonly applied in Circuit Board, IC, BGA /SMD Circuit Board,Motors, Lighting,Household Appliances and Industrial Equipment,Sensors, Wires, Fuses, Phone,Audio Wire, Motors, Lighting, Connectors,SMT Maintenance and Rework.
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    BEEYUIHF No Clean Lead Free Solder Paste Sn42 Bi58 (T3) 138? Melting Point

    beeyuihf solder flux paste

    Low temperature tin is often used for the maintenance of electronic products. The melting point of low temperature tin is 138 degrees Celsius, the particle size of tin powder is between 25 and 45 microns. Low temperature tin is mainly used for elements that cannot withstand high temperature device.

    Solder paste particle size: #3 (25-45 micrometers)

    rosin soldering flux

    #8300 lead-free solder paste, the paste is fine and smooth, preheat the PCB before soldering, during the soldering process, the paste will automatically return the components to the position, and quickly fixed.

    Properties and applications of lead-free 138? low melt electrical solder paste:

    lead free flux paste

    #8300 Solder Paste Feature: No clean, Delicate and moist, Bright solder joints, excellent solderability, and no bridging. Professional soldering jobs or DIY soldering can't be done without solder paste.

    BEEYUIHF 138? Low Temp Sn42 Bi58 SMD LED PCB BGA Electrical Sodering Paste #8300

    rosin paste flux

    Lead free solder tin paste application: soldering radiator modules & LED welding & high frequency welding & LED PCB BGA CPU SMT rework tools.

    Smooth & uniform solder joints/reflow does not create tin beads and tin bridges.

    rosin soldering flux

    Applications: Suit for LED soldering, Commonly applied in Circuit Board, IC, BGA /SMD Circuit Board,Motors, Lighting,Household Appliances and Industrial Equipment,Sensors, Wires, Fuses, Phone,Audio Wire, Motors, Lighting, Connectors,SMT Maintenance and Rework.

    BEEYUIHF No Clean Lead Free Solder Paste Sn42 Bi58 (T3) 138? Melting Point

    electronics flux paste

    Low temperature tin is often used for the maintenance of electronic products. The melting point of low temperature tin is 138 degrees Celsius, the particle size of tin powder is between 25 and 45 microns. Low temperature tin is mainly used for elements that cannot withstand high temperature device.

    Solder paste particle size: #3 (25-45 micrometers)

    electronic solder

    #8300 lead-free solder paste, the paste is fine and smooth, preheat the PCB before soldering, during the soldering process, the paste will automatically return the components to the position, and quickly fixed.

    Properties and applications of lead-free 138? low melt electrical solder paste:

    electronic solder

    #8300 Solder Paste Feature: No clean, Delicate and moist, Bright solder joints, excellent solderability, and no bridging. Professional soldering jobs or DIY soldering can't be done without solder paste.

    BEEYUIHF 138? Low Temp Sn42 Bi58 SMD LED PCB BGA Electrical Sodering Paste #8300

    solder paste

    Lead free solder tin paste application: soldering radiator modules & LED welding & high frequency welding & LED PCB BGA CPU SMT rework tools.

    Smooth & uniform solder joints/reflow does not create tin beads and tin bridges.

    electronic solder flux

    Applications: Suit for LED soldering, Commonly applied in Circuit Board, IC, BGA /SMD Circuit Board,Motors, Lighting,Household Appliances and Industrial Equipment,Sensors, Wires, Fuses, Phone,Audio Wire, Motors, Lighting, Connectors,SMT Maintenance and Rework.

    No Clean Solder Paste, Lead Free Soldering Paste Sn42 Bi58 (T3), 138 Melting Point Solder Paste for Electronics in jar ( 1.76 oz/50g)

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