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Sn63/Pb37 Solder Paste 183°C SMD BGA SMT Tin Lead No Clean | 50g no clean solder paste with tiny residue 183°C melting point for SMD BGA IC chip and phone motherboard precision welding
- Solder Paste Content: Alloy Tin 63% Tin / 37% Lead.
- Package Includes: 1 Can of Solder Paste, 50g/Can.
- Paste Features: Composition For Strong, Reliable Solder Joints With Excellent Wetting.
- Precise 183°C Melting Point: Low-Temperature Eutectic Formulation Melts Quickly And Evenly, Minimizing Thermal Stress On Sensitive Components.
- Applications: Widely Used in Circuit Board, lC, BGA /SMD Circuit Board,Motors, Lighting,TV and OtherHousehold Appliances And industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors,Lighting, connectors,SMT Maintenance.
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Sn63/Pb37 Solder Paste 183°C SMD BGA SMT Tin Lead No Clean | 50g no clean solder paste with tiny residue 183°C melting point for SMD BGA IC chip and phone motherboard precision welding
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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Return Policies
- Return for refund within: 30 days
- Return for replacement within: 30 days
- This item is covered by Heitenoy Return Policy
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