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Heatsink Kit 50 x 50 x 4 mm Thermal Conductive Adhesive Tape, Aluminium Thin Heat Sinks for Cooling Chipset Peltier Module 4Pcs
- 50mm anodized aluminum thin heat sinks
- Pre-applied thermal conductive double side adhesive tape backing
- Can be applied for passive cooling of 3D printers stepper motor, NEMA 17, TEC1-12706 Thermoelectric Peltier Cooler etc.
- Dimension: 1.97 x 1.97 x 0.16 inch / 50x50x4mm (L*W*H)
- Weight: 0.64 oz / 18 gram per unit
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Overview
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This 50mm (L) x 50mm (W) x 4 mm (H) extruded aluminum heatsink kit is specially designed for Cooling 3D Printer, NEMA 17, TEC1-12706 Thermoelectric Peltier Modules.
This set of heatsink height is 4 mm.
Item kit is made from 6063-T5 aluminum alloy with high thermal conductivity 201 W/m.K, structure stability and light weight.
The heatsink extrusion is in vertical and horizontal grooves; that is greatly increases the heat dissipation function.
This kit of heatsink comes with 50x50mm pre-applied thermal conductive double sided adhesive tape, for easy installation and optimum heat conductivity.
Material: Extruded Aluminum 6063-T5
Dimension: 50mm x 50mm x 4mm (L*W*H)
Weight: 0.64 oz /18 gram per piece
Mounting Style: SMD/SMT
Fin Style: Vertical
Tape Thermal Conductivity: 0.60 W/m-K
Standard: RoHS compliance
Package Includes: 4 pieces 50mm heatsink
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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Return Policies
- Return for refund within: 30 days
- Return for replacement within: 30 days
- This item is covered by Heitenoy Return Policy
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