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0.5x20x70mm M.2 SSD Thermal Pad Gap Heatsink Laird TFLEX-HR600 for Dell HP Lenovo Acer ASUS Laptop Desktop SMD IC RAM
- Compatible with M.2 SSD, CPU, Coolers, IC Processor, VGA cards, Laptops, Desktop PC, Mini Desktop, Game Consoles, Memorys, SMD components, Heatsink, 3D Printer, Raspberry Pi etc.
- Brand: Laird, model: TFLEX-HR600; Do NOt use thermal pads to replace thermal paste, or vice versa, High performance thermal paste also available.
- Dimension (Length x Width x Height): 70 x 20 x 0.5 mm
- Thermal Conductivity (w/mK): 12w/mK, Continuous Use Temperature: 50°C to -200°C.
- Each pack come with: 1X 0.5x20x70mm Thermal Pad.
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Compatible with Samsung 850EVO, 860EVO, 960EVO, 970EVO, 950PRO, 960PRO, 970PRO, SM951, SM961, PM951, PM961, CM871a, PM871, PM981, XP941, etc. (No Cutting required.)
Dimension (Length x Width x Height): 70 x 20 x 0.5 mm
Density (g/cm3): 2.8
Hardness (OO): 35
Thermal Conductivity (w/mK): 12w/mK
Continuous Use Temperature: 50°C to -200°C
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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Return Policies
- Return for refund within: 30 days
- Return for replacement within: 30 days
- This item is covered by Heitenoy Return Policy
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