Versatile Applications
TP-4 Thermal Pad
Ideal for RAM, chipsets, GPUs, consoles, laptops, and many other electronic components. Flexible, vibration-dampening, and easy to cut.

High Performance - Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.

Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.

Safe Application
Electrically insulating, non-adhesive, and easy to handle - for safe and reliable heat transfer.

Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.

Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.

Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.
Thermal Products in Comparison
Versatile Applications
TP-4 Thermal Pad
Ideal for RAM, chipsets, GPUs, consoles, laptops, and many other electronic components. Flexible, vibration-dampening, and easy to cut.

High Performance - Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.

Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.

Safe Application
Electrically insulating, non-adhesive, and easy to handle - for safe and reliable heat transfer.

Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.

Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.

Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.
| Color | Grey |
|---|---|
| Hardness | 50 Shore OO |
| Continuous Use Temperature | -40~150°C |
| Specific Gravity | 3.4 g/cm³ |
| Compression Ratio | 47 % @50 psi |
| Tensile?Strength | 1 psi |
| Breakdown Voltage | 8.62 kV/mm |
| Dielectric Constant @1MHz | 7.2 @ 1MHz |
| Volume Resistance | 1.52 x 10¹² O-cm |
| Flammability | UL94 V-0 |
Thermal Products in Comparison
![]() TP-4 | ![]() TP-3 | ![]() MX-7 | ![]() MX-6 | ![]() MX-4 | ![]() MX Cleaner |
|---|---|---|---|---|---|
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| Price | |||||
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| Dimensions (in mm) | |||||
| 100 x 100, 120 x 20 | 100 x 100, 200 x 100, 120 x 20 | / | / | / | 115 x 115 |
| Thickness (in mm) | |||||
| 0.5–1.5 | 0.5–1.5 | / | / | / | / |
| Specific Gravity | |||||
| 3.4 g/cm³ | 3.4 g/cm³ | 2.9 g/cm³ | 2.6 g/cm³ | 2.5 g/cm³ | / |
| Continuous Use Temperature | |||||
| -40~150 ? | -40~150 ? | -50~250 ? | -50~150 ? | -50~150 ? | / |
| Volume Resistivity | |||||
| / | / | 35,000 - 38,000 Poise | 45,000 Poise | 31,600 Poise | / |
| Specific resistance | |||||
| 1.52 x 10¹² O-cm | 2.69 x 10¹² O-cm | 1.7 x 10¹² O-cm | 1.8 x 10¹² O-cm | 3.8 x 10¹³ O-cm | / |
| Hardness | |||||
| 50 Shore OO | 55 Shore OO | / | / | / | / |























