Thermal Paste CPU Cooler Hot Melt Adhesive for Radiators Heatsink PC Fan Processors Liquid Cooler Master Water Cooling

Thermal Paste CPU Cooler Hot Melt Adhesive for Radiators Heatsink PC Fan Processors Liquid Cooler Master Water Cooling

Describe thermal paste selects much more tiny particle diameter metal oxide as the main raw materials, used for filling the gap between the heat source and heat sink device. Its outstanding performance on the CPU GPU LED will meet your high standard demand for cooling system.

Product features:

Accord with RoHS and REACH environmental protection requirements. High thermal conductivity, high insulation, high temperature resistant, low oil separation, non-corrosive.

Working principle:

Filling the gap between heating element and the cooling device; Increasing the contact area so as to achieve the soundest thermal conductivity effect.

Method of use:

It's normal phenomena if there is little silicone oil floating above. Please stir well before use. Keep the coated surface clean and apply directly with tools (such as scraper, finger cot, etc).

Warm notice:

Keep children away from it. If it is swallowed or inadvertently come into eyes, ear, nose, mouth,please flush with clean water or send to hospital when necessary.

Storage:

Preservation at normal temperature. Please cover it after used, avoiding impurities such as dust, that have a bad effect on thermal conductivity.