The base plate is made of T2 purple copper, with a high thermal conductivity of 401W/m.k, which enhances heat conduction performance and increases the heat dissipation area.
The 0.3MM jet-type micro features 56 water channels, increasing the heat absorption area and delivering powerful heat dissipation performance.
The matte texture process backplate is made of high-quality aluminum material and is installed in an upper and lower interlayer style, providing all-round protection.
The full-coverage steel plate is extended to 136.55MM, increasing the water flow coverage area. Reducing the weight of the GPU BLOCK, protecting the PCB from deformation, and combining with the electroless nickel plating surface treatment process, the thermal resistance of the 0.001-0.002MM coating thickness is almost zero, while more effectively preventing corrosion and erosion.
Designed with a 9.5MM copper plate, it uses sufficient materials and adopts a single-layer sealing ring design to effectively reduce the risk of leakage.