360mm Copper Heat Sink, High Performance Liquid Cooling Heat Exchanger with G1/4 Port for PC Water Cooling and High Power Dissipation Equipment

[HIGH THERMAL CONDUCTIVITY] Crafted from premium 99.9% pure copper for superior heat transfer efficiency (385-401 W/m·K), outperforming aluminum alternatives in high-heat applications like gaming PCs and industrial equipment.
[OPTIMIZED FIN DESIGN] Features skived copper fins that maintain continuous thermal pathways from base to tip, ensuring maximum heat dissipation for components up to 165W TDP without weak welds or glue joints.
[VERSATILE COMPATIBILITY] Perfect for PC water cooling systems, 3D printers, large LED arrays, and beauty equipment with G1/4 threaded ports that support easy installation in multiple configurations (120mm to 480mm sizes available).
[SILENT HIGH PERFORMANCE] Engineered with optimal fin density (15.5-51.3cm lengths) to deliver exceptional cooling capacity at ultra-low noise levels, making it ideal for noise-sensitive environments like recording studios.
[DURABLE CONSTRUCTION] Antioxidant copper construction resists while 2.5-2.7cm fin height provides ideal balance between area and airflow clearance for both passive and active cooling setups.