Compatibility: Intel Core i7/i5/i3 (Socket LGA1156/1155) Connector: 3 Pin Max. Air Flow: 39.7 CFM Max. Air Pressure: 2.57 mmH2O Noise: 22 dBA Multi-orientation heat sink design provide sufficient airflow to VRM, chipset and memory area Optimal fin ratio and fan combination provide a cost-effective solution with good thermal performance Style:Budget Multi-orientation heat sink design provide sufficient airflow to VRM, chipset and memory area.Optimal fin ratio and fan combination provide a cost-effective solution with good thermal performance Spring/screw and back plate provide robust fixing with board during shipping. Silent operation.