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AJMRTC AXK6A2337YG BoardtoBoard Header Connector,120Pin 0.5mm Pitch SMD 3.0mm Stack Height,IndustrialGrade Mezzanine Interconnect for ALINX FPGA SoM Embedded PCB Repair Replacement
- - Industrialgrade 120pin SMD boardtoboard header with 0.5mm fine pitch, 3.0mm mated stack height, perfect replacement for AXK6A2337YG used on ALINX FPGA coretocarrierboard connection
- - TOUGHCONTACT goldplated copper alloy contacts deliver low contact resistance, antivibration performance, rated for 50 mating cycles for longterm industrial embedded operation
- - UL94V0 flameretardant heatresistant housing supports standard SMT reflow soldering; integrated positioning bosses prevent offset during pickandplace assembly
- - 0.5A perpin rated current, max total 10A, maintains stable highspeed signal integrity for FPGA systemonmodule, industrial control and custom embedded hardware projects
- - Compact highdensity mezzanine interconnect; matching mating socket and correct PCB footprint required for complete boardstack assembly
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Overview
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AJMRTC AXK6A2337YG surfacemount boardtoboard mezzanine header is a highdensity industrial interconnect designed for stacking two printed circuit boards without cabling. This 120position, 0.5 mm pitch header adopts TOUGHCONTACT goldplated copper alloy terminals to sustain low contact resistance and stable signal transmission under shock and vibration conditions, rated for 50 insertionremoval cycles. The UL94V0 molded resin housing tolerates SMT reflow soldering temperatures, and builtin positioning bosses guarantee accurate component alignment during massproduction PCB assembly. It is widely deployed for ALINX ZYNQ7000 and UltraScale+ MPSoC FPGA SoM linking to carrier boards, as well as industrial control modules, embedded development hardware and compact custom electronic devices. Professional SMT soldering expertise and proper PCB footprint design are mandatory for installation. Corresponding mating socket must be purchased separately to finish boardtoboard interconnection.
- Brand: AJMRTC
- Reference Part Number: AXK6A2337YG
- Connector Type: BoardtoBoard Mezzanine Header
- Pin Count: 120 Pins, DualRow
- Pitch: 0.5 mm
- Mated Stack Height: 3.0 mm
- Mounting Style: SMD SurfaceMount
- Contact Material: Copper Alloy, NickelGold Plating
- Rated Current: 0.5A per pin, Max Total 10A
- Mating Cycles: 50 Times
- Housing Material: UL94V0 HeatResistant FlameRetardant Resin
- Feature: Builtin Positioning Bosses
- Compatible Application: ALINX FPGA SoM, Industrial Control, Embedded PCB Interconnection
- Condition: New Aftermarket Connector
- Important Note: Matching mating socket and proper PCB footprint required for assembly
Warranty & Returns
Warranty, Returns, And Additional Information
Warranty
- Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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Return Policies
- Return for refund within: 30 days
- Return for replacement within: 30 days
- This item is covered by ThermalNest Return Policy
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