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Team Group T-FORCE G50 M.2 2280 4TB PCIe 4.0 x4 with NVMe 1.4 TLC Internal Solid State Drive (SSD) TM8FFE004T0C129
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    Alphacool Apex Thermal Putty X1 - 50g (14945)

    • Alphacool Apex Thermal Putty is a high-performance solution for thermally bonding heat-sensitive electronic components to the heatsink.
    • As a non-curing silicone gel, it offers an electrically non-conductive alternative to traditional thermal pads and was specifically developed for applications where flexibility, low mechanical stress, and high thermal conductivity are crucial.
    • A key advantage of Apex Thermal Putty lies in its optimal consistency for processing and dimensional stability.
    • The material conforms perfectly to varying gap heights under slight pressure while maintaining its shape.
    • This allows for reliable compensation of unevenness and tolerances between the cooler and component, ensuring optimal contact between the heat source and the heatsink at all times.
    • This is particularly important for modern graphics cards and other sensitive electronic components, as it protects delicate components such as memory chips and voltage regulators from damage.
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    Alphacool Apex Thermal Putty is a high-performance solution for thermally bonding heat-sensitive electronic components to the heatsink. As a non-curing silicone gel, it offers an electrically non-conductive alternative to traditional thermal pads and was specifically developed for applications where flexibility, low mechanical stress, and high thermal conductivity are crucial.

    A key advantage of Apex Thermal Putty lies in its optimal consistency for processing and dimensional stability. The material conforms perfectly to varying gap heights under slight pressure while maintaining its shape. This allows for reliable compensation of unevenness and tolerances between the cooler and component, ensuring optimal contact between the heat source and the heatsink at all times. This is particularly important for modern graphics cards and other sensitive electronic components, as it protects delicate components such as memory chips and voltage regulators from damage.

    The sophisticated formula design of Alphacool Apex Thermal Putty combines high thermal conductivity with a reduced bond line thickness (BLT), thereby lowering thermal resistance and improving heat dissipation. Bond line thickness describes the thickness of the thermal interface material layer between the component and the heat sink. Simultaneously, the high vertical stability, combined with long-term stable material properties, ensures lasting material integrity without sagging, cracking, or contamination of adjacent components, making the product ideal for professional applications.

    These properties result in a wide range of applications for Alphacool Apex Thermal Putty. Wherever reliable, flexible, and mechanically gentle heat transfer is required, Apex Putty offers a high-performance and future-proof solution.


    Technical Data
    Flow Rate (g/min)
    20 (Test method: 30 cc EFD cartridge / 2.5 mm nozzle, 90 psi)
    Density (g/cc)
    3.8 (Test method: ASTM D792)
    Minimum bond line thickness (mm)
    0.2 mm
    Continuous operating temperature (degrees Celsius)
    -20 to 125 °C
    Thermal conductivity (W/mK)
    10 (Test method: ASTM D5470)
    Volume resistivity (Ohm·cm)
    1.0 × 10¹³ (Test method: ASTM D257)
    Dielectric strength (kV/mm)
    >/= 5 (Test method: ASTM D149)
    Weight
    50g
    Color
    Blue-Grey

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    Warranty, Returns, And Additional Information

    Warranty

    • Please contact the Seller directly for warranty information. Warranty information may also be found on the Manufacturer's website.
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    • Return for refund within: 30 days
    • Return for replacement within: 30 days
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