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Generation S Double chamber pump: Upgrade the water flow to a custom copper-bottomed microchannel with water pressure and a sinking scoop FIN for lower thermal resistance and better performance.
Heat dissipation up to 280W: Support for overclocking
Low resistance water discharge: fin increase, heat dissipation area increased by 25%
120mmARGB &PWM fan: Air volume and pressure upgrade, custom and synchronous ARGB lighting effect, PWM intelligent speed regulation.
FEP water cooling pipe: more corrosion resistance, industrial grade seal, water cooling liquid evaporation rate is lower, longer service life.
CF14 High performance thermal paste, thermal conductivity up to 14K/MK.