Specification: Chip
Model: TEC1-12705.
Dimensions: 40 * 40 * 3.8 mm.
Component: Logarithm of 127.
Cooling power: Qcmax 30W.
Assembly Pressure: 85N/cm2.
Storage conditions: -40 ~ 60C.
Rated voltage: DC12V
(Vmax: 15.5V ).
Maximum temperature: Tmax
(Qc = 0): 60C.
Encapsulation Process: Standard 704 Silastic Seal.
Operating current: Imax = 12 (rated voltage startup).
Wire Size: Lead Length 100 5mm, RV standard wire, Single head 5mm Tin Plated.
Internal resistance: 2.4 ~ 2.7 (ambient temperature 23 1C, 1kHZ Ac test).
Working environment: Temperature range -55C ~ 83C (high ambient temperature will directly affect the cooling efficiency).
Package Included: 6PCS X TEC1-12705 Heatsink Thermoelectric Cooler Cooling Peltier Plate Module