Made of high quality Aluminum, good thermal conductivity. Reduce the risk of hardware failure due to overheating.
^^ Size: L*W*H - 200mm x 69mm x 36mm ( 7.87 inch x 2.71 inch x 1.41 inch) ^^ Maximize surface area designed in contact with the cooling air. The 27 pcs fins increase the area of the board and thus provide for greater heat transfer ^^ Widely use for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc. ^^ please make sure that the size of the heat sink fits that of your component.