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JINTAI TPM 2.0 TPM 12pin SLB9670 Module for MSI MS4462 MPG B550 MPG B650 MPG X570S MEG X570S X670E MEG X670E A520M MAG A520M Motherboard Compatible with TPM2.0
- TPM 2.0 (12pin-1) Compatible with MPG B550 GAMING CARBON WIFIMPG B550 GAMING EDGE WIFIMPG B650 EDGE WIFIMPG B650 CARBON WIFIMPG X570S CARBON MAX WIFIMPG X570S CARBON EK XMPG X570S EDGE MAX WIFIMEG X570S UNIFY-X MAXMEG X570S ACE MAXX670E GAMING PLUS WIFIMEG X670E ACEA520M PROA520M-A PROA520M PRO-C DASHA520M PRO-VHA520M PRO-VDHMAG A520M BAZOOKA WIFIMAG A520M VECTOR WIFIWS WRX80
- Chipset:SLB9670 Compatible with MPG B550 GAMING CARBON WIFIMPG B550 GAMING EDGE WIFIMPG B650 EDGE WIFIMPG B650 CARBON WIFIMPG X570S CARBON MAX WIFIMPG X570S CARBON EK XMPG X570S EDGE MAX WIFIMEG X570S UNIFY-X MAXMEG X570S ACE MAXX670E GAMING PLUS WIFIMEG X670E ACEA520M PROA520M-A PROA520M PRO-C DASHA520M PRO-VHA520M PRO-VDHMAG A520M BAZOOKA WIFIMAG A520M VECTOR WIFIWS WRX80
- Important Notes: This product is only compatible with older motherboards such as INTEL and AMD. It is not compatible with newer motherboard models featuring firmware TPM, all-in-one computers, or laptops.
- Important Notes: The m
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Overview
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TPM 2.0 (12pin-1) Compatible with MPG B550 GAMING CARBON WIFIMPG B550 GAMING EDGE WIFIMPG B650 EDGE WIFIMPG B650 CARBON WIFIMPG X570S CARBON MAX WIFIMPG X570S CARBON EK XMPG X570S EDGE MAX WIFIMEG X570S UNIFY-X MAXMEG X570S ACE MAXX670E GAMING PLUS WIFIMEG X670E ACEA520M PROA520M-A PROA520M PRO-C DASHA520M PRO-VHA520M PRO-VDHMAG A520M BAZOOKA WIFIMAG A520M VECTOR WIFIWS WRX80 ^^
Chipset: SLB9670 Compatible with MPG B550 GAMING CARBON WIFIMPG B550 GAMING EDGE WIFIMPG B650 EDGE WIFIMPG B650 CARBON WIFIMPG X570S CARBON MAX WIFIMPG X570S CARBON EK XMPG X570S EDGE MAX WIFIMEG X570S UNIFY-X MAXMEG X570S ACE MAXX670E GAMING PLUS WIFIMEG X670E ACEA520M PROA520M-A PROA520M PRO-C DASHA520M PRO-VHA520M PRO-VDHMAG A520M BAZOOKA WIFIMAG A520M VECTOR WIFIWS WRX80 ^^
Important Notes: This product is only compatible with older motherboards such as INTEL and AMD. It is not compatible with newer motherboard models featuring firmware TPM, all-in-one computers, or laptops.
^^ Important Notes: The minimum hardware requirements for upgrading to Windows 11 via
TPM 2.0 are as follows: a 1 GHz or faster 64-bit processor (dual-core/multi-core), 4 GB of RAM, 64 GB of storage space, firmware supporting UEFI Secure Boot and TPM 2.0, a DirectX 12-compatible graphics card, and a display with a resolution of 720p or higher.
^^ Purpose a: Resolve TPM 2.0 verification issues when upgrading to Windows 11, enabling it to function as an independent encryption chip, providing secure storage for sensitive data, and enhancing overall security; ^^
Purpose b: Hardware encryption acceleration, such as improving game lag issues and other functions.
Chipset: SLB9670 Compatible with MPG B550 GAMING CARBON WIFIMPG B550 GAMING EDGE WIFIMPG B650 EDGE WIFIMPG B650 CARBON WIFIMPG X570S CARBON MAX WIFIMPG X570S CARBON EK XMPG X570S EDGE MAX WIFIMEG X570S UNIFY-X MAXMEG X570S ACE MAXX670E GAMING PLUS WIFIMEG X670E ACEA520M PROA520M-A PROA520M PRO-C DASHA520M PRO-VHA520M PRO-VDHMAG A520M BAZOOKA WIFIMAG A520M VECTOR WIFIWS WRX80 ^^
Important Notes: This product is only compatible with older motherboards such as INTEL and AMD. It is not compatible with newer motherboard models featuring firmware TPM, all-in-one computers, or laptops.
^^ Important Notes: The minimum hardware requirements for upgrading to Windows 11 via
TPM 2.0 are as follows: a 1 GHz or faster 64-bit processor (dual-core/multi-core), 4 GB of RAM, 64 GB of storage space, firmware supporting UEFI Secure Boot and TPM 2.0, a DirectX 12-compatible graphics card, and a display with a resolution of 720p or higher.
^^ Purpose a: Resolve TPM 2.0 verification issues when upgrading to Windows 11, enabling it to function as an independent encryption chip, providing secure storage for sensitive data, and enhancing overall security; ^^
Purpose b: Hardware encryption acceleration, such as improving game lag issues and other functions.
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- Return for refund within: 30 days
- Return for replacement within: 30 days
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