Gerioie BGA Stencils Template, Directly Heat Set Kit BGA Reballing Stencils, for Laptop

These stencils were made by high quality material, can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Feature: These stencils are made of high quality stainless steel, the thickness of steel mesh is perfect. They can be heated by the hot air machine, these stencils are not easy to deform when heated. There are 6 different sizes and totally 130pcs, enough to meet your various needs. The specifications are marked on the surface, convenient for you to choose. It is specially designed for laptop, desktop, communication main board north-south bridge, and graphics card, etc all kinds of BGA chips.
Specification:
Material: Stainless
SteelColor:
SilverQuantity: 130pcs
Weight: Approx. 268g 9.5 oz
Package List: 3pcs x BGA Stencils for 0.35 mm Solder Ball2pcs x BGA Stencils for 0.4 mm Solder Ball7pcs x BGA Stencils for 0.45 mm Solder Ball35pcs x BGA Stencils for 0.5 mm Solder Ball60pcs x BGA Stencils for 0.6 mm Solder Ball23pcs x BGA Stencils for 0.76 mm Solder Ball