[66mm Gravity-Optimized Heatpipes] Built with six 6mm heatpipes using gravity-optimized layout to accelerate heat transfer and maintain stable cooling performance for high-load CPUs.
[Dual-Tower Reinforced Cooling Structure] The reinforced dual-tower design expands heat dissipation surface area, while the innovative anti-deformation bracket ensures long-term structural stability.
[Copper Reflow Soldering Base] A premium copper base with reflow soldering technology improves contact efficiency and thermal conductivity for consistent CPU temperature control.
[120mm High-Performance ARGB PWM Fan] Equipped with a 120mm ARGB fan delivering up to 73.32 CFM airflow and 3.28 mmHO static pressure, combining powerful cooling with vivid lighting effects.
[Wavy Flow Fin Stack for Optimized Airflow] The wavy fin stack design reduces airflow resistance and turbulence, improving overall cooling efficiency and noise control.