Pure Copper Heat Dissipation, Absorb Heat QuicklyMade of pure copper, the thermal conductivity up to 40.1W /(mK. ). Copper heat sinks has nearly double the thermal conductivity than aluminumMinimalist Metal Line DesignMetallic lines, sharp edges and corners, simple and beautiful, Compatible with more devicesCompatible NVMe/NGFF
The product is suitable for M2 SSDs with NVMe/NGFF protocol, compatible with 22X80 size hard drivesEquipped with Two Thermally Conductive Silicon PadThe heat of the hard disk can be quickly exported through the copper heat sink to protectthe data security of the hard disk54 Copper Fins Forheat Dissipation (Model 3) Quickly remove the heat generated by the hard drive, 54 copper fins forheat dissipation, increasing the air contactarea (heat dissipation area 21600mm2), fitting the air duct ofthe chassis to quickly remove heatModel 1: The ulitra-thin design of pure copperis suitable for use in very small spaces, The bottom is stainless steel, not copper.
Top copper thickness 3mmModel 2: The upper and lower all-copper designhas doubled the heat dissipation area, Top
copper thickness 5mmModel 3: Ultra-slim design, a thickness of 8.5 mm pure copper fin, The pure copper fin has alarge heat dissipation area of 21600mm2Model 1:
L: 72mm
W: 23mm
H: 3mmTool-less design
Pure copper heat dissipationAdvantages: ultra-thin, not the top graphics card is generally strongDisadvantages: The heat dissipation has been improved, and the effect is averageModel 2:
L: 72mm
W: 23mm
H: 5mmScrew design All pure copper thickens and dissipates heatAdvantages: ultra-thin, firm, versatile
and strongDisadvantages: The heat dissipation has been improved, and the effect is averageModel 3:
L: 72mm
W: 23mm
H: 8mmScrew design All pure copper thickens and dissipates heatAdvantages: ultra-thin, firm, large
heat dissipation areaDisadvantages: Passive heat dissipation