BGA Repair Station

Product description:
BGA Repair Station

Professional application GPU chip repair, notebook repair, computer motherboard repair.

As well as disassembly and replacement of medium and large chips.
Power supply: Ac220v±10%, 50/60hz

Power: 3300W

Heating power: Upper heating power, Max. 800W

Lower heating power: Max. 1200W

Infrared heating power: Max. 1800w

PCB location way V-shape card slot+universal jigs and fixture

Temperature controlling

High accuracy K-type thermocouple close-loop control, independent temperature

control, the precision up to ±2 degree

Electrical material High sensitive touch screen+temperature control module+microcontrollers

PCB size Max300×280mm Min 10×10 mm

Chip size Max60×60mm Min 1×1 mm

PCB thickness 0.3 -5mm

Temperature sensor 1pcs

Overall dimension L460×W480×H500mm

Weight 30kg
1-Upper heating device

2-Upper nozzle

3-Preheating device

4-Multifunctional fixing frame

5-Left pallet

6-Lower nozzle

7-Industrial LCD touch screen (English interface)

8-Up and down adjustment buttons

9-Front and rear adjustment buttons

10-Lighting

11-Right pallet

12-Height adjustment of heating zone

13-Upper heating indicator

14-Lower heating indicator

15-Vacuum suction tube

16-Temperature monitoring interface
Overview:


1. Using the industrial touch screen, the temperature is displayed on the touch screen by real-time curve, with functions of curve analysis and curve changes.


2. Can store hundreds of users' temperature curve data. With laser position light, locate the chip repair center fast, with high location accuracy and efficient operation.


3. Independent 3 heating zones, upper and lower heaters are hot air, the lower heating zone can be adjusted up and down. The lower heater is infrared, temperature accuracy is controlled within ±2 degree, the upper and lower heater can be moved front and back, left and right. Upper and lower heater zones can set 9 segments temperature controlling at the same time. An infrared heating zone can adjust the output power according to the actual requirement.


4. Titanium alloy BGA nozzle can be rotated in 360 degrees, easier to repair the different places of the chip. Adopting the high accuracy K-type thermocouple close-loop control. The external temperature measuring interface detects the temp accurately.